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1	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) INTERCONNECTS HIGH-K DEVICES Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-04-01 03:01:20 Semiconductor device fabrication Copper interconnect Chemical-mechanical planarization Plating GlobalFoundries Wafer Back end of line Fraunhofer Society Copper plating Silicon Saxony
2	process_catalogue_blattversion2014.indd Add to Reading List Source URL: www.screening-fab.com Language: English - Date: 2016-02-05 07:17:09 Chemistry Semiconductor device fabrication Scientific method Learning Electronics manufacturing Atomic physics Molecular physics Spectroscopy Back end of line Front end of line Characterization Electron microscope
3	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) 2 1 Add to Reading List Source URL: www.screening-fab.com Language: English - Date: 2016-02-10 06:01:49 Semiconductor device fabrication Copper interconnect Chemical-mechanical planarization Plating Wafer GlobalFoundries Back end of line Fraunhofer Society
4	rudolph technologies Providing a broad range of inspection, lithography, metrology and software technologies for a wide variety of applications Add to Reading List Source URL: www.tamartechnology.com Language: English - Date: 2012-12-21 10:27:49 Semiconductor device fabrication Electronics manufacturing Back end of line Chip-scale package Metrology Bump Business Technology
5	process_catalogue_blattversion2014.indd Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-03-05 00:19:05 Chemistry Spectroscopy Semiconductor device fabrication Learning Scientific method Electronics manufacturing Atomic physics Molecular physics Back end of line Front end of line Characterization Electron microscope
6	Constant Voltage Electromigration for Advanced Interconnects TECHNICAL BRIEF After decades of reliance on Constant Current Electromigration (CIEM) to predict the electromigration lifetime of back end of line (BEOL) inter Add to Reading List Source URL: www.cascademicrotech.com Language: English - Date: 2015-04-17 19:38:56
7	Constant Voltage Electromigration for Advanced Interconnects TECHNICAL BRIEF After decades of reliance on Constant Current Electromigration (CIEM) to predict the electromigration lifetime of back end of line (BEOL) inter Add to Reading List Source URL: www.cmicro.com Language: English - Date: 2015-04-17 19:38:56
8	Design Impact of FinFETs Carey Robertson Product Marketing Director Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-05-28 12:18:25 Mentor Graphics Multiple patterning Multigate device Back end of line Design rule checking Electromagnetic field solver Electronic engineering Electronics Electronic design automation
9	3D IC WORKING GROUP MEETING OCTOBER 16, 2013 3D IC Working Group Meeting Agenda  2:00 pm Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:26 Electronics Technology 3D computer graphics Three-dimensional integrated circuit Mentor Graphics Field-programmable gate array 3D modeling Back end of line Integrated circuit Electronic engineering Semiconductor device fabrication Visual effects
10	qctconnect.com QUALCOMM CONFIDENTIAL AND PROPRIETARY Roadmap for Design and EDA Infrastructure for 3D Products Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:30:09 Semiconductor device fabrication Technology Three-dimensional integrated circuit Interposer Qualcomm Dynamic random-access memory Back end of line Application-specific integrated circuit Through-silicon via Integrated circuits Electronics Electronic engineering

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